Molybdenum copper alloy is a pseudo-alloy composed of two insoluble metals molybdenum and copper and gains characteristics both of these two metals, such as high thermal conductivity, low thermal expansion coefficient, non-magnetic, low gas content, good machining performance and special high temperature performance.
Grades of MoCu alloy include Mo85Cu15、Mo80Cu20、Mo70Cu30、Mo60Cu40、Mo50Cu50、Mo40Cu60 and so on. Different grades match different densities, thermal conductivities and coefficients of thermal expansion. Other customized grades also can be customized.
Molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.